CPU Physical Design Engineer

Job description

**Brief About Tech Mahindra – Silicon Engineering** Tech Mahindra **Silicon Engineering** is a key part of Tech Mahindra's semiconductor and engineering services portfolio, delivering end-to-end solutions across the silicon lifecycle for global semiconductor, automotive, consumer, and industrial clients. The practice focuses on **VLSI, embedded systems, and platform engineering** , supporting customers from architecture and design through verification, validation, and sustenance engineering. The Silicon Engineering unit works across **IP, Subsystem, and SoC-level development** , offering capabilities in areas such as **Design Verification, RTL Design, DFT, Physical Design, Post-Silicon Validation, Embedded Software, and System Modeling & Simulation** . Teams leverage industry-standard methodologies, tools, and verification frameworks to deliver high-quality, production-ready silicon solutions. Backed by **Tech Mahindra's global engineering DNA** , the Silicon Engineering practice collaborates with leading semiconductor and technology clients worldwide, operating as an extended engineering arm to accelerate innovation, reduce time-to-market, and ensure reliable, scalable silicon platforms. It is part of Tech Mahindra's broader engineering-led growth strategy serving multiple global industries. **About the Role** We are seeking a talented and motivated **CPU Physical Design Engineer** to join our Silicon Engineering team. In this role, you will be responsible for the physical implementation of high-performance CPU cores and subsystems, driving designs from netlist to GDSII while meeting aggressive power, performance, and area (PPA) targets. You will work closely with RTL, Design, DFT, Timing, Architecture, and CAD teams to deliver world-class CPU designs for next-generation semiconductor products. This role offers the opportunity to work on advanced technology nodes and cutting-edge CPU architectures for global semiconductor leaders. **Key Responsibilities** - Drive end-to-end **CPU Physical Design implementation** from synthesis through signoff. - Perform **floor planning, power planning, placement, clock tree synthesis (CTS), routing, and physical verification** . - Execute timing closure activities and optimize designs for **Power, Performance, and Area (PPA)** targets. - Analyze and resolve setup, hold, signal integrity, and congestion issues. - Perform design optimization using ECO methodologies and timing-driven implementation techniques. - Collaborate closely with RTL, DFT, STA, and architecture teams for design convergence. - Work on advanced technology nodes (5nm/3nm and below) and high-frequency CPU designs. - Perform physical signoff checks including **DRC, LVS, ERC, IR Drop, EM, and Noise Analysis** . - Develop and maintain implementation flows, methodologies, and automation scripts. - Debug design implementation issues and drive closure with cross-functional teams. - Participate in design reviews, technical discussions, and customer interactions. - Support tapeout activities and ensure successful silicon delivery. **Qualification** **BE/BTech/ME/MTech** degree in Electronics, Electrical, VLSI, Microelectronics, Computer Engineering, or related disciplines. **Required Skills** - Strong experience in **CPU Physical Design / Block-Level / Full-Chip Physical Design** - Hands-on expertise in: - Floorplanning - Power Planning - Placement & Optimization - Clock Tree Synthesis (CTS) - Routing - Physical Verification - Good understanding of **Static Timing Analysis (STA)** concepts. - Experience in timing closure for high-performance designs. - Knowledge of signal integrity, crosstalk, IR Drop, and electromigration analysis. - Hands-on experience with industry-standard EDA tools such as: - Cadence Innovus - Synopsys ICC2 - PrimeTime - Tempus - Experience with advanced technology nodes (16nm, 7nm, 5nm, 3nm, etc.). - Strong scripting skills in **Tcl, Perl, Python, or Shell** . - Good understanding of low-power implementation methodologies. - Excellent debugging, analytical, and problem-solving skills. **Preferred Skills** - Experience with **ARM CPU, x86 CPU, RISC-V CPU, or High-Performance Compute (HPC) designs** . - Exposure to hierarchical and full-chip implementation flows. - Experience in physical signoff and tapeout activities. - Knowledge of UPF/CPF-based low-power design implementation. - Familiarity with automation and flow development. - Experience in advanced-node design methodologies and process technologies. **Experience Range: 4-15 Years** **Why Join Tech Mahindra Silicon Engineering?** Join a team of semiconductor experts delivering next-generation CPU and SoC solutions for leading global technology companies. Work on advanced-node silicon, high-performance computing architectures, and innovative semiconductor products while contributing to cutting-edge CPU Physical Design and implementation excellence.