Senior Engineer - IC Package Design

Job description

****Company:**** Qualcomm India Private Limited ****Job Area:**** Engineering Group, Engineering Group > Packaging Engineering ****General Summary:**** **Role Overview** We are seeking an **IC Package Design Engineer** to support the **planning, coordination, and execution of IC package design activities** across complex semiconductor product development programs. This role emphasizes **program execution, cross‑functional coordination, and delivery predictability** , supporting package design efforts from **early feasibility and design planning through tapeout and manufacturing readiness** . The engineer will collaborate closely with **package designers, integration engineers, SI/PI teams, manufacturing partners, and operations teams** to ensure alignment, issue tracking, and timely delivery of package milestones. EDA tools and automation are used primarily as **enablers of execution** , while the core focus of this role is on **driving clarity, managing dependencies, and reducing execution risk** . ****Minimum Qualifications:**** - Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field. ****Key Responsibilities**** **Program Execution & Coordination (Primary Focus)** - Support execution of IC package design programs from early design planning through tapeout and post‑tapeout support. - Develop and maintain execution plans, schedules, task lists, and milestone trackers. - Track risks, issues, dependencies, and action items across package design, verification, and manufacturing activities. - Drive action item follow‑up, escalation, and closure with clear ownership and timelines. - Prepare and deliver status updates, execution summaries, dashboards, and readiness reports for project and engineering stakeholders. - Support design reviews and execution checkpoints by coordinating inputs, capturing outcomes, and tracking follow‑up actions. - Use project and program management tools (e.g., dashboards, Gantt charts, milestone trackers, dependency maps) to provide clear visibility into execution status. **Cross‑Functional & External Engagement** - Coordinate across Package Design, Package Integration, SI/PI, and Operations teams to ensure execution alignment. - Work closely with Package Process teams to align design assumptions with manufacturing capabilities, process constraints, and yield considerations. - Interface with New Product Introduction (NPI) teams to support package readiness for qualification, ramp, and high‑volume manufacturing. - Partner with Substrate Engineering & Technology teams to track substrate development, availability, risks, and schedule alignment. - Engage with OSATs and Suppliers to support execution readiness, resolve blocking issues, and ensure manufacturability alignment. - Coordinate with EDA and tooling teams to ensure design flows and tools are ready to support program needs. **Design, EDA & Process Enablement (Supporting / Enabling Role)** - Use existing package design flows, EDA tools, reference methodologies, and execution checklists to support program execution. - Draft, document, and maintain process flows that clearly define execution steps, handoffs, inputs, and outputs across the package design lifecycle. - Develop clear, structured documentation describing: - Package design and execution workflows - Design release and handoff steps - Readiness checks and acceptance criteria - Common issues, failure modes, and escalation paths - Translate complex technical activities into repeatable, well‑defined process steps that can be consistently followed across teams. - Support EDA and design‑flow issue triage, coordinating with subject‑matter experts and tool owners as needed. - Apply light scripting or automation where helpful to support reporting, consistency checks, or process enforcement. - Capture lessons learned and best practices and incorporate them into updated process documentation and workflows. ****Required Skills & Experience**** **Program & Execution Skills (Core)** - Experience supporting complex, cross‑functional engineering programs. - Strong organizational skills with the ability to manage multiple workstreams in parallel. - Experience using project / program management tools, including: - Execution dashboards - Milestone and dependency trackers - Gantt charts or schedule views - Action‑item and risk tracking tools - Comfortable driving execution in matrixed organizations without direct reporting authority. - Strong written and verbal communication skills. **Technical Context (Enabling)** - Familiarity with IC package development lifecycles and execution flows. - Working knowledge of IC package design, layout, integration, or manufacturing concepts. - Exposure to package design or EDA tools such as: - Cadence APD / SIP - Cadence Innovus / Virtuoso - Mentor Xpedition - Valor and RAVEL - Scripting or automation experience (e.g., Python, TCL) is a plus but not required. ****Minimum Qualifications:**** - Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field. **Applicants** : Qualcomm is an equal opp