ISP Program Manager
Tata Electronics · Mayang, Assam, India
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Tata Electronics · Mayang, Assam, India
Role Overview The Program Manager – OSAT is responsible for leading large, complex customer programs from concept through high-volume manufacturing. This role serves as the single point of accountability for program execution—integrating customer requirements, engineering development, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery. A major focus of this position is operations readiness for new products (NPI to HVM transition), including capacity planning, qualification, ramp management, and alignment of cross-functional teams within an outsourced semiconductor assembly and test environment. Key Responsibilities Program Leadership & Execution • Own end-to-end execution of multiple customer programs within the OSAT business unit. • Act as the primary interface between customers and internal organizations (Technology Development, Factory NPI and Process Engineering, Operations/Manufacturing, Quality, Supply Chain, and Finance). • Develop and maintain integrated program schedules, milestones, and deliverables. • Drive structured program governance: stage gates, risk reviews, and executive reporting. • Manage program financials including cost optimisation models, margins, and change management. Customer Engagement • Lead customer technical and business reviews, ensuring alignment on scope, schedule, and performance. • Translate customer requirements into actionable internal plans. • Manage customer escalations and ensure rapid issue resolution. • Support commercial teams in RFQs, SOWs, and new business opportunities. Operations Readiness & NPI • Lead NPI to HVM transition activities including: • Factory readiness (equipment, capacity, tooling, materials) • Qualification planning (DOE, reliability, process validation) • Yield ramp strategies and learning cycles • Coordinate process development, product engineering, and manufacturing teams. • Ensure BOM, process flows, test programs, and quality controls are production-ready. Cross-Functional Coordination • Chair core team meetings and drive accountability across functions. • Manage risk registers, mitigation plans, and contingency strategies. • Partner with Industrial Engineering on line design, cycle time, and capacity modeling. • Align with Quality on customer qualifications, audits, and compliance. Continuous Improvement • Establish program management best practices, KPIs, and dashboards. • Drive lessons-learned and standardization across programs. • Support digitalization of program tracking and factory execution. Required Qualifications- Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field. • 15+ years of experience in semiconductor manufacturing, OSAT, or advanced packaging. • Relevant years of experience in program/project management with direct customer ownership. • Proven experience with: • New Product Introduction (NPI) and HVM ramp • Assembly & Test processes (wire bond, flip chip, WLCSP, BGA, SiP, etc.) • Semiconductor quality systems (APQP, FMEA, Control Plans, 8D) • Strong knowledge of: • Manufacturing operations, capacity planning, and yield management • Supply chain coordination and material readiness • Cost modeling and program financial management • Excellent stakeholder management and communication skills. • Ability to influence cross-functional teams without direct authority. Preferred Qualifications- Master’s degree in Engineering, Operations, or MBA. • Experience working directly in an OSAT or IDM ATM environment. • PMP / PgMP / PRINCE2 certification. • Hands-on background in: • Package development and reliability qualification • Test engineering and product bring-up • Factory automation and MES systems • Experience with Tier-1 global customers in mobile, automotive, HPC, or networking. • Six Sigma Green/Black Belt certification.