Process Engineer - Plating

Job description

Responsibilitis • Have strong background knowledge in EOL process and equipment for mold, plating,laser mark, trim and form. • Can support and train problem solving methodologies: • 7 QC tools, • Basic SPC include SPC training, • Yield analysis with analytics • Sampling plan • 8D • DMAIC Overview • Process mapping • Implementing Poka Yoke/ Lean Manufacturing • Design of Experiment (DOE) • FMEA • Knowledgeable in SPC tools (Minitab or JMP) is an advantage • Develop and implement production processes and can ensure to meet high quality standards • Develop and maintain accurate documentation of process changes, updates, and compliance with quality standards Essential Attributes • Can work closely and effectively with cross-functional team (Production, Quality, NPI) to develop and implement SOPs. Qualification • Educational Background: A Bachelor’s degree in Electronics/ Electrical Engineering, Mechanical Engineering, or a related field is typically required. Desired Exprience Level • With minimum 8 years’ experience in assembly engineering on semiconductors industry