Process Engineering

Job description

Role Overview SME - Solder Paste Printer & Reflow Soldering is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products. The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams. Responsibilities • Technology & Process Setup • Manage & Optimization of SMT Production Processes of Solder Paste Printing , Inspection & Reflow. • Define and maintain all process windows, control plans & CTQ across all products of SPP , SPI & Reflow. • Setup, Operate, Programming, Optimizing SPP & Reflow Soldering machines. • Setup & Validation of Stencils, Squeegees, Solder Paste types & Printing parameters. • Develop & validate thermal profiles for new & existing PCB assemblies. • Stencil Design & Validation. • Conduct DOE & Process validation for new products and materials. • Setup , Monitor & Control critical reflow parameters (Zone temp., Conveyor Speed, Soak time, Peak temp.) • New Model Readiness • Develop & Maintain Process documentation, WIs & SOPs (SPP, SPI & Reflow) • All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation. • Partner with NPI, TDG to ensure DFMEA and PFMEA of SPP,SPI & Reflow (related to soldering & thermal constraints ) • Ensure proper solder paste reflow per component and PCB design requirements • Ensure smooth technology transfer from development to production. • Own ramp-up metrics: yield learning curve, cycle time, scrap reduction. • Quality Excellence • Accountable for first pass yield, final yield and field reliability. • Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis. • Monitor production yield , defect rates , cycle time and implement corrective / preventive actions. • Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints and solder balls • Partner with Quality team to address customer returns, audits and escalations. • Monitor Process parameters ( temp. Zones , conveyor speedsoak time etc ) • Analyze & control print defects ( Insufficient / excess paste , smearing , bridging , skips , misalignment) • Analyze soldering defects ( tombstoning , voids , cold joints , bridging etc ) and implement corrective actions • Operational Excellence & Cost Optimization • Own cost of ownership and productivity improvement initiatives. • Drive Cycle time and line balancing improvements. • Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing ) • To ensure Proper line setup , programming , Program version management ( SPP , SPI & Reflow ) • To ensure compliance with ESD , Safety& IPC standards. • Analyze process data , SPC reports to identify trends & improvement opportunities. • Customer & Stakeholder Engagement • Serve as a technical team member for customers on PCBA Soldering process topics. • Will be technical team member for customer reviews, technology discussions and risk mitigation plans. Key Deliverables & KPI • First Pass Yield • Yield and Reliability Performance • Productivity Improvement • Cost Optimization • Customer satisfaction and audit outcomes. Education Qualifications • Bachelor in related Engineering Discipline (Preferred Electronics Engineering) • 10-12 years’ hands on experience in SMT industry in a similar role ( Paste Printing , Inspection & lead free soldering processes ) • Experience in high volume manufacturing environment. • Hands on knowledge of SPP machines ( MPM Momentum / ASM Dek / Ekra / GKG / Fuji / Panasonic ) • Hands on experience with SMT reflow ovens with vacuum / without vacuum ( Heller / Ersa Rehm / Vitronics Soltec etc ) • Familiar with thermal profilers ( KIC , Datapaq , ECD etc ) • Deep Understanding of solder paste behaviour & thermal profiling • Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE ) • Strong knowledge on Stencil designing (Thickness , aperture , step up / down stencils ) • Familiar with Lean manufacturing