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Job description

**Responsibilities** - Develop and maintain deep understanding of molding materials, equipment parameters, and process controls in Transfer Molding and Post-Mold Cure stations. - Monitor, analyze, and improve process performance indicators such as yield, OEE, UPH, and scrap rate for molding operations. - Drive quality issue resolution through structured problem-solving methodologies (8D, 5 Whys, DOE, SPC). - Collaborate with equipment engineering and production teams to ensure alignment with product and customer specifications. - Actively lead process troubleshooting and implement robust corrective/preventive actions to avoid recurrence of quality issues. - Spearhead cost reduction activities through material utilization improvement, automation, cycle time reduction, and process optimization. - Champion process capability improvements, ensure CPK/SPC monitoring, and maintain process stability. - Support customer audits and take ownership in audit preparation, response, and closure of findings related to the molding process. - Define and update SOPs, BKM (Best Known Methods), PFMEA, Control Plans, and Work Instructions to ensure process documentation integrity and compliance. - Drive automation and digital transformation in molding processes—such as auto mold vision inspection, predictive maintenance triggers, and reduction of human dependency. - Support NPI (New Product Introduction) builds, including tool qualifications, molding parameter development, and data gathering for engineering evaluations. - Provide process knowledge sharing and training to technicians and operators to uplift line performance and minimize process variation. - Coordinate with global teams to benchmark molding process technologies and deploy global best practices. **Education** - Bachelor’s degree in Mechanical, Materials, Electronics Engineering or a related field. **Experience & Skill** - Minimum of 3 to 5 years of working experience and, preferably in Transfer Molding /EOL processes of Semiconductor packaging. - Hands-on experience with transfer molding machines, mold tools, and associated metrology systems. - Strong analytical and statistical skills (SPC, Minitab, JMP, etc.). - Familiarity with EOL process flow and interdependencies between molding, PMC, laser marking, singulation and final test. - Proven experience in process optimization, problem-solving, and cross-functional collaboration.