Process Engineering

Job description

Role Overview SME - Pick n Place / Mounter is responsible for overseeing, optimizing & continuously improving processes to ensure on-time manufacturing with high quality of all ISP Products. Also to handle end to end machine setup , programming , trouble shooting and process optimization in PCB assembly The role is accountable for process yield, reliability, cost saving while building strong cross functional alignment with NPI & TD, equipment, quality and customer teams. Responsibilities • Technology & Process Setup • Define and maintain all process windows, control plans & CTQ across all products of PnP. • Setup, Operate, Programming & Optimizing PnP machines. • Conduct DOE & Process validation for new products and materials. • Perform feeder loading , nozzle selection & calibration. • Optimize component placement accuracy and speed. • Create & modify machine programs using online/offline SW. • Optimize cycle time and improve placement efficiency. • Perform Penalization and coordinate transformation. • Validate BOM , Centroid file and Gerber data before production. • New Model Readiness • Develop & Maintain Process documentation, WIs & SOPs (Pick n Place / Mounter) • All new models trail pre-readiness (EVT/ DVT / PVT) , new model trail activities including trial builds & process validation. • Load & verify machine programs for New Product Trail. • Conduct First Article Inspection. • Partner with NPI, TDG to ensure DFMEA and PFMEA of Pink n Place / Mounter. • Ensure proper solder paste reflow per component and PCB design requirements • Ensure smooth technology transfer from development to production. • Own ramp-up metrics: yield learning curve, cycle time, scrap reduction. • Quality Excellence • Accountable for first pass yield, final yield and field reliability. • Lead root cause analysis for yield excursions using SPI data , SPC charts , Yield Trends ,FMEA, DOE and failure analysis. • Monitor production yield , defect rates , cycle time and implement corrective / preventive actions. • Collaborate with Quality , NPI & Customer to resolve manufacturing & Quality issues such as tombstoning , voiding , bridging , cold joints, misalignment , missing components and solder balls. • Partner with Quality team to address customer returns, audits and escalations. • Analyze following defects ( Identify root causes of defects like tombstoning , misalignment , missing components etc. ) and implement corrective actions • Monitor Placement Quality and defect rates. • Maintain Process documentation & Production reports. • Operational Excellence & Cost Optimization • Own cost of ownership and productivity improvement initiatives. • Drive Cycle time and line balancing improvements. • Lead process development , validation & continuous improvement initiatives ( Kaizen , Poka yoke , Lean Manufacturing ) • To ensure Proper line setup , programming , Program version management ( Pick n Place/Mounter ) • To ensure compliance with ESD , Safety& IPC standards. • Meet daily production targets & OEE goals • Coordinate with production planning , quality & maintenance teams • Diagnose and resolve machine alarms and placement defects • Handle feeder related issues , vision alignment errors & nozzle problems • Minimize downtime & improve machine utilization • Customer & Stakeholder Engagement • Serve as a technical team member for customers on PCBA Process Topics. • Will be technical team member for customer reviews, technology discussions and risk mitigation plans. Key Deliverables & KPI • First Pass Yield , RTY and Reliability Performance • Productivity Improvement , Production Target Vs Actual Achievement • Cost Optimization • Customer satisfaction and Audit outcomes. • Placement Accuracy Education Qualifications • Bachelor in related Engineering Discipline (Preferred Electronics Engineering) • 10-12 years’ hands on experience in SMT industry in a similar role ( PnP Programming & Optimization ) • Experience in high volume manufacturing environment. • Hands on knowledge of PnP machines ( ASMPT / Fuji / Panasonic ) • Deep Understanding of solder paste behavior & thermal profiling • Proficiency in root cause analysis & problem solving tools ( 8D , 5 why , DOE ) • Familiar with Lean manufacturing • Strong knowledge of SMT Process Flow