Training Technicians

Job description

Job Title: Training Technicians Key Responsibilities • Deliver practical and theoretical training on IC manufacturing processes such as: • Wafer handling and preparation • Die attach, wire bonding, and flip-chip processes • Encapsulation / molding techniques • Trimming, forming, and singulation • Electrical testing, burn-in, and final test • Train students on semiconductor equipment operation, tool handling, and basic machine troubleshooting. • Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices. • Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes. • Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum. • Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations. • Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing. • Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness. • Track trainee performance, attendance, and competency development; maintain training documentation. • Support internal and external assessors during OSAT certification assessments. • Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline. • Coordinate with industry partners, assessment bodies, and placement teams when required. Required Qualifications • ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology. • OSAT / NSQF / Semiconductor Skill Certification preferred. Experience • 1–5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing. • Experience in cleanroom or ESD-controlled environments is highly desirable. • Training or mentoring experience is an added advantage. Technical Skills • Knowledge of semiconductor assembly and test processes. • Understanding of IC packaging types (DIP, QFN, BGA, CSP, etc.). • Familiarity with ESD standards, cleanroom protocols, and contamination control. • Basic understanding of yield, defects, and failure analysis. • Ability to read process flow diagrams, SOPs, and equipment manuals. • Basic computer skills for reporting and documentation. Soft Skills • Clear communication and demonstration skills. • Strong discipline and safety-first mindset. • Patience and ability to train entry-level candidates. • Willingness to upgrade skills with evolving semiconductor technologies. Work Environment • Training labs simulating cleanroom and IC manufacturing environments. • May require extended hours during assessments or industry-aligned programs. Key Performance Indicators (KPIs) • Trainee competency and OSAT assessment success rate. • Compliance with cleanroom, ESD, and safety standards. • Equipment uptime and lab readiness. • Trainee feedback and placement readiness in semiconductor roles.