Training Technicians

Job description

Job Title: Training Technicians **Key Responsibilities** - Deliver practical and theoretical training on IC manufacturing processes such as: - Wafer handling and preparation - Die attach, wire bonding, and flip-chip processes - Encapsulation / molding techniques - Trimming, forming, and singulation - Electrical testing, burn-in, and final test - Train students on semiconductor equipment operation, tool handling, and basic machine troubleshooting. - Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices. - Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes. - Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum. - Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations. - Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing. - Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness. - Track trainee performance, attendance, and competency development; maintain training documentation. - Support internal and external assessors during OSAT certification assessments. - Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline. - Coordinate with industry partners, assessment bodies, and placement teams when required. **Required Qualifications** - ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology. - OSAT / NSQF / Semiconductor Skill Certification preferred. **Experience** - 1–5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing. - Experience in cleanroom or ESD-controlled environments is highly desirable. - Training or mentoring experience is an added advantage. **Technical Skills** - Knowledge of semiconductor assembly and test processes. - Understanding of IC packaging types (DIP, QFN, BGA, CSP, etc.). - Familiarity with ESD standards, cleanroom protocols, and contamination control. - Basic understanding of yield, defects, and failure analysis. - Ability to read process flow diagrams, SOPs, and equipment manuals. - Basic computer skills for reporting and documentation. **Soft Skills** - Clear communication and demonstration skills. - Strong discipline and safety-first mindset. - Patience and ability to train entry-level candidates. - Willingness to upgrade skills with evolving semiconductor technologies. **Work Environment** - Training labs simulating cleanroom and IC manufacturing environments. - May require extended hours during assessments or industry-aligned programs. **Key Performance Indicators (KPIs)** - Trainee competency and OSAT assessment success rate. - Compliance with cleanroom, ESD, and safety standards. - Equipment uptime and lab readiness. - Trainee feedback and placement readiness in semiconductor roles.